Flexible CPU/RFCPU®


With TFT technology acquired through our research on liquid crystal display, we succeeded in forming the world’s first CPU on glass substrate in 2002.
Through further application of this technology, we also succeeded in forming CPU on plastic substrate and driving wireless circuit using the CPU.

History of Our CPU Technology Development

2002 Succeeded in forming the world’s first CPU on a glass substrate with Sharp Corporation
2003 Announced a CPU on a glass substrate at International Solid State Circuits Conference (ISSCC)
2004 Succeeded in forming and driving CPU on a plastic substrate for the first time in the world
2005 Announced a CPU with a wireless function at International Electron Devices Meeting (IEDM)
2007 Announced a CPU with a wireless function at International Solid State Circuits Conference (ISSCC)

Flexible CPU with a wireless function(915 MHz)
■ Flexible CPU with a wireless function(915 MHz)
*RFCPU is a registered trademark of Semiconductor Energy Laboratory Co., Ltd.
(Japanese trademark registration No. 4963906).